Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Waterproof mems pressure sensor package with a metal lid and an embedded ePTFE filter and process of making

Waterproof mems pressure sensor package with a metal lid and an embedded ePTFE filter and process of making

US Patent 12428292 · Granted Sep 30, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reduced light reflection package2024
High-range semiconductor load sensor device2023
Composite structures2023
Reduced light reflection package2023
MEMS stress reduction structure embedded into package2023
Semiconductor structures2023
Microelectromechanical microphone2023
MEMS device and process2022
Packaging for MEMS transducers2022
Packaging for a MEMS transducer2022
Semiconductor structures2022
Packaging for a MEMS transducer2021