Multi-loop cycling heat dissipation module

Assignee

• Acer Incorporated

Inventors

• Yu-Ming Lin (456 patents)
• Wen-Neng Liao (74 patents)
• Cheng-Wen Hsieh (67 patents)
• Chun-Chieh Wang (180 patents)
• Tsung-Ting Chen (22 patents)
• Chi-Tai Ho (8 patents)
• Kuan-Lin Chen (50 patents)
• Jau-Han Ke (20 patents)

View full patent text on Google Patents →