Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package with plurality of leads and sealing resin

Semiconductor package with plurality of leads and sealing resin

US Patent 12412812 · Granted Sep 9, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device including passive element2025
Semiconductor package with plurality of leads and sealing resin2024
Semiconductor device having distinguishable electrodes2023
Method of manufacturing semiconductor device with internal and external electrod2023
Semiconductor package with plurality of leads and sealing resin2022
Semiconductor device2021
Semiconductor device with internal and external electrode and method of manufact2021
Semiconductor device with external terminal2020
Multi-chip module and method for manufacturing same2020
Semiconductor device2019
Semiconductor device2018
Electronic component and manufacturing method thereof2018