Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Setting up ultra-small or ultra-thin discrete components for easy assembly

Setting up ultra-small or ultra-thin discrete components for easy assembly

US Patent 12412772 · Granted Sep 9, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of transferring a die from a carrier to a receive substrate, and related2025
Adhesive tapes for receiving discrete components2025
Dynamic release tapes for assembly of discrete components2025
Parallel assembly of discrete components onto a substrate2024
Connecting electronic components to substrates2024
Dynamic release tapes for assembly of discrete components2024
Parallel assembly of discrete components onto a substrate2023
Methods for releasing ultra-small or ultra-thin discrete components from a subst2023
Parallel assembly of discrete components onto a substrate2021
Setting up ultra-small or ultra-thin discrete components for easy assembly2021
Placing ultra-small or ultra-thin discrete components2020
Setting up ultra-small or ultra-thin discrete components for easy assembly2020