Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Release layer for metal foil with carrier and metal foil comprising the same

Release layer for metal foil with carrier and metal foil comprising the same

US Patent 12408279 · Granted Sep 2, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Metal foil, carrier with metal foil comprising the same and printed circuit boar2025
Metal foil, carrier with metal foil comprising the same and printed circuit boar2025
Metal foil, carrier with metal foil comprising the same and printed circuit boar2025
Metal foil, carrier with metal foil comprising the same and printed circuit boar2025
Carrier foil-attached metal foil, method of manufacturing the same, and laminate2024
Carrier foil-attached metal foil, method of manufacturing the same, and laminate2024
Plated laminate and printed circuit board2022
Plated laminate and printed circuit board2022
Method for producing porous copper foil and porous copper foil produced by the s2021
Method for producing substrate formed with copper thin layer, method for manufac2017
Liquid additive for etching silicon nitride and silicon oxide layers, metal ink 2016
Substrate structure and method of manufacturing the same2014