Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dielectric silicon nitride barrier deposition process for improved metal leakage and adhesion

Dielectric silicon nitride barrier deposition process for improved metal leakage and adhesion

US Patent 12406880 · Granted Sep 2, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Small grain size polysilicon engineering for threshold voltage mismatch improvem2025
Fin field-effect transistor semiconductor device and method of forming the same2025
Integrated circuits including composite dielectric layer2024
Process for preparing oxycodone hydrochloride having less than 25 ppm 14-hydroxy2024
Carbon and/or oxygen doped polysilicon resistor2024
Integrated circuits having dielectric layers including an anti-reflective coatin2024
LED luminaire with VOC barrier2024
Lens to produce wide angle light output in high density LED arrays2024
Thin film resistor with punch-through vias2023
Thin film resistor with punch-through vias2023
Capacitor comprising a bismuth metal oxide-based lead titanate thin film2023
Lens to produce high angle off-axis light with wide beam width2023