Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power device embedded printed circuit board assemblies with thin film dielectric layers

Power device embedded printed circuit board assemblies with thin film dielectric layers

US Patent 12387994 · Granted Aug 12, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Analog AI computing architecture2025
AI-based automated circuit generation method2025
Horizontal computer numerical control (CNC) machining device for crankshaft2025
Method of designing fluid flow field structure for fuel cell bipolar plate2025
Power device embedded printed circuit board-cold plate assemblies with low inter2025
Power device embedded printed circuit board-cold plate assemblies with low inter2025
Power device embedded printed circuit board-cold plate assemblies with low inter2025
3D printed cold plates and methods for cooling power devices embedded in 3D prin2025
Charging a battery of an electric vehicle hovering in the air2025
Optical module and erbium-doped fiber amplifier2025
UV curable dielectric materials for 3D printing and 3D printing systems with the2025
UV curable dielectric materials for 3D printing and 3D printing systems with the2025