Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and device for providing through-openings in a substrate and a substrate produced in said manner

Method and device for providing through-openings in a substrate and a substrate produced in said manner

US Patent 12365051 · Granted Jul 22, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substrate made of glass and method for the production thereof2025
Substrate made of glass and method for the production thereof2025
Method for producing a display having a carrier substrate, a carrier substrate p2025
Method for producing a glass-plastic connection2025
Site-specific connecting of glass substrates2023
Site-specific connecting of glass substrates2023
Method and device for providing through-openings in a substrate and a substrate 2023
Method and device for providing through-openings in a substrate and a substrate 2023
Method and device for providing through-openings in a substrate and a substrate 2023
Method for introducing at least one cutout or aperture into a sheetlike workpiec2023
Method for introducing at least one cutout or aperture into a sheetlike workpiec2023
Method and device for the integration of semiconductor wafers2022