Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Double-sided integrated circuit die and integrated circuit package including the same

Double-sided integrated circuit die and integrated circuit package including the same

US Patent 12356724 · Granted Jul 8, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Battery management system and battery cell array2021
Battery management system and battery cell array2021
Data storage device that divides and processes a command and data processing sys2019
Storage device, computing system including the storage device, and method of ope2018
Method and apparatus of estimating circuit delay2010
Multithreaded data processing method with long latency subinstructions2001