Multilayer electronic component having structure for improved adhesion force and moisture protection

Assignee

• Samsung

Inventors

• Hyung Jong CHOI (9 patents)
• Yoo Jeong Lee (22 patents)
• Chung Yeol Lee (15 patents)
• Kwang Yeun Won (11 patents)
• So Jung An (10 patents)
• Kang Ha Lee (7 patents)
• Woo Kyung Sung (14 patents)
• Myung Jun Park (80 patents)
• Jong Ho Lee (424 patents)

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