Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming a semiconductor structure by diffusing manganese from a seed layer to a barrier layer

Method for forming a semiconductor structure by diffusing manganese from a seed layer to a barrier layer

US Patent 12341101 · Granted Jun 24, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Forming interconnect structures in semiconductor devices2025
Forming interconnect structures in semiconductor devices2025
Package structure, semiconductor device and manufacturing method thereof2025
Self-aligned scheme for semiconductor device and method of forming the same2025
Self-aligned scheme for semiconductor device and method of forming the same2025
Self-aligned scheme for semiconductor device and method of forming the same2025
Devices with reduced capacitances2025
Devices with reduced capacitances2025
Semiconductor device including parallel configuration2025
SOIC chip architecture2025
Thermal sensor device by back end of line metal resistor2025
Homogeneous source/drain contact structure2025