Semiconductor element unit and method of manufacturing thereof, semiconductor element unit supply substrate, and semiconductor packaging circuit and method of manufacturing thereof

Assignee

• Oki Electric Industry Co.

Inventors

• Yuuki SHINOHARA (2 patents)
• Takahito Suzuki (55 patents)
• Kenichi TANIGAWA (9 patents)
• Hironori FURUTA (12 patents)
• Toru Kosaka (43 patents)
• Yusuke Nakai (26 patents)
• Shinya JYUMONJI (5 patents)
• Genichirou MATSUO (1 patents)
• Takuma Ishikawa (36 patents)
• Chihiro Takahashi (13 patents)
• Hiroto KAWADA (4 patents)

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