Semiconductor tool for copper deposition

Assignee

• TSMC

Inventors

• Chia-Hung Tsai (22 patents)
• Chin-Szu Lee (52 patents)
• Szu-Hua Wu (30 patents)
• Jui-Hung Ho (5 patents)
• Chi-Hung Liao (116 patents)
• Yu-Jen Chien (13 patents)

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