Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for preparing semiconductor device with composite passivation structure

Method for preparing semiconductor device with composite passivation structure

US Patent 12315796 · Granted May 27, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor structure2025
Method of manufacturing semiconductor structure having heat dissipation structur2025
Semiconductor device structure including a bonding structure2025
Semiconductor device with polymer liner and method for fabricating the same2025
Semiconductor structure having vias with different dimensions2025
Semiconductor device with redistribution structure and method for fabricating th2025
Method of manufacturing semiconductor structure having vias with different dimen2025
Semiconductor structure having heat dissipation structure2025
Manufacturing method of semiconductor package structure having interconnections 2025
Semiconductor structure having elastic member within via2025
Semiconductor package structure having interconnections between dies and manufac2025
Semiconductor device2025