Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for simultaneously slicing a multiplicity of slices from a workpiece

Method and apparatus for simultaneously slicing a multiplicity of slices from a workpiece

US Patent 12311577 · Granted May 27, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wire saw, wire guide roll and method for simultaneously cutting a multiplicity o2024
Method for simultaneously cutting a multiplicity of slices of particularly unifo2017
Carrier, method for coating a carrier, and method for the simultaneous double-si2017
Apparatus and method for simultaneously slicing a multiplicity of slices from a 2016
Method for simultaneously cutting a multiplicity of wafers from a workpiece2016
Device and method for buffer-storing a multiplicity of wafer-type workpieces2015
Method and apparatus for trimming the working layers of a double-side grinding a2015
Method for trimming the working layers of a double-side grinding apparatus2015
Insert carrier and method for the simultaneous double-side material-removing pro2015
Method for trimming the working layers of a double-side grinding apparatus2014
Method for the simultaneous double-side material-removing processing of at least2014
Method for the simultaneous material-removing processing of both sides of at lea2014