Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Laminate, laminate with buildup layer, laminate with metal foil, and circuit board

Laminate, laminate with buildup layer, laminate with metal foil, and circuit board

US Patent 12284755 · Granted Apr 22, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hydrogel and uses therefor2025
Switching element and method for manufacturing same2024
Hydrogel, use thereof, and production method therefor2022
Switching element having overlapped wiring connections and method for fabricatin2019
Variable resistance element and method for producing variable resistance element2019
Resin particles and process for producing same, antiglare film, light-diffusing 2018
Porous resin particles, method of manufacturing porous resin particles, and use 2017
Method for forming wiring2016
Method for forming resistance changing element capable of operating at low volta2016
Resistance changing element capable of operating at low voltage, semiconductor d2015
Variable resistance element, semiconductor device including variable resistance 2014