Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device comprising a drain back contact electrode, method of manufacturing the same, and semiconductor package structure

Semiconductor device comprising a drain back contact electrode, method of manufacturing the same, and semiconductor package structure

US Patent 12272743 · Granted Apr 8, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dual output energy conversion device, modulation method and power supply device2025
Anti-interleukin-23 P19 antibodies and methods of use thereof2025
Methods, systems, devices, media and products for video processing2025
Semiconductor device comprising a doped epitaxial layer and method of manufactur2025
High-viscosity, high-elasticity, and anti-aging composite modified asphalt and a2024
Watch buckle2024
Watch buckle2024
Heat dissipation system for high-speed train running in low-vacuum tube2024
Method and apparatus for determining phase locking of critical arc light2024
Partial discharge (PD) detection apparatus for gas-insulated equipment2023
Semiconductor device, semiconductor chip and method of manufacturing semiconduct2022
Anti-CLauDiN 18 antibodies and methods of use thereof2022