Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integration techniques for micromachined pMUT arrays and electronics using thermocompression bonding, eutectic bonding, and solder bonding

Integration techniques for micromachined pMUT arrays and electronics using thermocompression bonding, eutectic bonding, and solder bonding

US Patent 12263507 · Granted Apr 1, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Micro-machined ultrasound transducers with insulation layer and methods of manuf2025
Configurable ultrasonic imager2025
Configurable ultrasonic imager2025
Imaging devices with selectively alterable characteristics2025
Thumb-dominant ultrasound imaging system2025
Integrated ultrasonic transducers2025
High density multi-poled thin film piezoelectric devices and methods of making t2025
High density multi-poled thin film piezoelectric devices and methods of making t2025
Systems and methods for integrating ultrasonic transducers with hybrid contacts2025
Systems and methods for integrating ultrasonic transducers with hybrid contacts2025
Ultrasound transducer with acoustic absorber structure2025
Integration techniques for micromachined pMUT arrays and electronics using therm2024