Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package substrate with CTE matching barrier ring around microvias

Package substrate with CTE matching barrier ring around microvias

US Patent 12243835 · Granted Mar 4, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Enhanced mold compound thermal conductivity2025
Electronic device and multilevel package substrate with elevated trace features 2025
Semiconductor device package with improved die pad and solder mask design2025
Semiconductor device package with improved die pad and solder mask design2025
Multilevel package substrate with stair shaped substrate traces2025
Application deployment method, application blueprint generation method, platform2025
Package heat dissipation including a die attach film2025
Package substrate having porous dielectric layer2024
Core-shell quantum dot, preparation method thereof, and electroluminescent light2024
Method of forming package substrate with partially recessed capacitor2023
Multilayer package substrate with stress buffer2023
Memory motor winding multiplexing control method and system for flux linkage obs2022