Metal heterojunction structure with capping metal layer

Assignee

• TSMC

Inventors

• Yi-Sheng Lin (83 patents)
• Chi-Jen Liu (40 patents)
• Chi-Hsiang Shen (13 patents)
• Te-Ming Kung (13 patents)
• Chun-Wei Hsu (97 patents)
• Chia-Wei Ho (14 patents)
• Yang-Chun Cheng (11 patents)
• William Weilun Hong (29 patents)
• Liang-Guang Chen (72 patents)
• Kei-Wei Chen (195 patents)

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