Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › CMUT-on-CMOS ultrasonic transducer by bonding active wafers and manufacturing method thereof

CMUT-on-CMOS ultrasonic transducer by bonding active wafers and manufacturing method thereof

US Patent 12208416 · Granted Jan 28, 2025

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Conduit retractor2025
Edge computing-based additive manufacturing real-time monitoring method and syst2025
Techniques for force and torque-guided robotic assembly2025
In-situ evaluation method and system for loess collapsibility based on non-destr2025
Method and apparatus for collaborative end-to-end large model-oriented self-driv2025
Large-scale underground shield docking model test platform and test method using2025
Alkane catalytic dehydrogenation reaction device and catalyst regeneration devic2025
Method for identifying and evaluating toxigenic capability of aflatoxigenic stra2025
Method and system for 3D contour reconstruction of AM parts based on light field2025
Snack box2025
Systems and techniques for cleaning pressure membrane systems using a water-in-a2024
SOC PMUT suitable for high-density system integration, array chip, and manufactu2024