Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Manufacture method of a high-resistivity silicon handle wafer for a hybrid substrate structure

Manufacture method of a high-resistivity silicon handle wafer for a hybrid substrate structure

US Patent 12176202 · Granted Dec 24, 2024

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process of producing a non-ferrous metallic tube2024
Continuous casting nozzle assembly for casting of a metallic pipe2018
High-resistive silicon substrate with a reduced radio frequency loss for a radio2016