Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chip

Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chip

US Patent 12159859 · Granted Dec 3, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device including multi-capping layer and method for manufacturing 2025
Semiconductor device including multi-capping layer and method for manufacturing 2025
Compact atom interferometry inertial navigation sensors with tailored diffractiv2025
Measurement protocol for large dynamic range and high sensitivity of an evanesce2025
Antenna radome and electronic device including the same2025
Semiconductor device including a support layer with openings2025
Semiconductor devices including a through-hole electrode2025
Semiconductor devices including a through-hole electrode2025
Semiconductor devices including a through-hole electrode2025
Semiconductor devices including a through-hole electrode2025
Thin-film transistor, display apparatus including the same, and method of manufa2025
Laundry treating apparatus2025