Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bump coplanarity for semiconductor device assembly and methods of manufacturing the same

Bump coplanarity for semiconductor device assembly and methods of manufacturing the same

US Patent 12154879 · Granted Nov 26, 2024

Estimated economic value: $57,813,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit structure with avalanche junction to doped semiconductor over2024
Apparatuses and methods including patterns in scribe regions of semiconductor de2023
Electrostatic discharge clamp structures2023
Diode triggered silicon controlled rectifier2023
Bump coplanarity for semiconductor device assembly and methods of manufacturing 2023
Bump coplanarity for semiconductor device assembly and methods of manufacturing 2023
Integrated circuit structure with avalanche junction to doped semiconductor over2022
Diode triggered silicon controlled rectifier (SCR) with hybrid diodes2022
Electrostatic discharge device2022
Electrostatic discharge clamp structures2021
Bi-directional breakdown silicon controlled rectifiers2021
Silicon-controlled rectifiers with wells laterally isolated by trench isolation 2020