Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip package

Multi-chip package

US Patent 12136608 · Granted Nov 5, 2024

Estimated economic value: $16,523,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Case for electronic device and magnetic assembly2025
Case for electronic device and magnetic assembly2025
Outdoor lighting fixture2025
Sensor die package2025
Slanted glass edge for image sensor package2025
Outdoor lighting fixture2025
Method for recognizing arteries and veins on a fundus image using hyperspectral 2025
Jellyfish lamp2024
Wafer level proximity sensor2024
Slanted glass edge for image sensor package2024
Method for manufacturing a wafer level chip scale package (WLCSP)2024
Base assembly and lighting device2023