Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for improving the release of chips in the laser perforation of thin films

System and method for improving the release of chips in the laser perforation of thin films

US Patent 12136547 · Granted Nov 5, 2024

Estimated economic value: $10,713,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and system for printing verified a non-fungible token2025
Method and system for printing verified copy of a non-fungible token2024
Airflow control via self-closing holes in movable support surface of a printing 2024
Devices, systems, and methods for supplying makeup air through openings in carri2023
Devices, systems, and methods for controlling airflow through vacuum platen of p2023
Topcoat composition of imaging blanket with improved properties2023
Devices, systems, and methods for supplying makeup air through openings in carri2023
Vacuum belt deburring assembly2023
Multi-layer imaging blanket2022
Printed electronic devices exhibiting improved yield2020
Printed electronic devices exhibiting improved yield2020
Protective layers for high-yield printed electronic devices2019