Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for integrating a dispensable light transmissible aperture in the cap of a thin light sensor module

Method for integrating a dispensable light transmissible aperture in the cap of a thin light sensor module

US Patent 12125935 · Granted Oct 22, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electromagnetic interference (EMI) shielding in optical sensors2025
Strategic placement of plastic structures for EMI management of transceiver modu2020
Communication module handle2020
Electromagnetic radiation shielding on a PCI express card2019
Thermal interface2019
Strategic placement of plastic structures for EMI management of transceiver modu2019
Chip on leadframe optical subassembly2019
Thermally conductive flexible member for heat transfer2017
Biasing assembly for a latching mechanism2016
Constraining ball lens in an optical subassembly2015
Optical network unit transceiver2015
Constraining ball lens in an optical subassembly2015