Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods

Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods

US Patent 12118726 · Granted Oct 15, 2024

Estimated economic value: $18,016,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of determining and/or calibrating a cutter height on a wedge bonding mac2025
Cleaning systems for wire bonding tools, wire bonding machines including such sy2025
Ultrasonic welding systems for conductive pins, and related methods2025
Systems and methods of operating wire bonding machines including clamping system2020
Approach for assembling and repairing probe assemblies using laser welding2012
Thermoplastic molding material1994
Thermoplatic molding materials1994
Molding compositions of a styrene polymer, a polyolefin and a triblock styrenic 1994
Impact-resistant thermoplastic molding material and its use1992
Thermoplastic molding material1992
Thermoplastic molding materials1992
Transparent thermoplastic blends1991