Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025

Method of bonding substrates and separating a portion of the bonded substrates through the bond, such as to manufacture an array of liquid lenses and separate the array into individual liquid lenses

US Patent 12116303 · Granted Oct 15, 2024

Estimated economic value: $27,953,000

Assignee

Inventors

View full patent text on Google Patents →