Semiconductor package and manufacturing method thereof

Assignee

• TSMC

Inventors

• Jen-Jui Yu (11 patents)
• Chih-Chiang Tsao (34 patents)
• Hsuan-Ting Kuo (35 patents)
• Mao-Yen Chang (14 patents)
• Hsiu-Jen Lin (136 patents)
• Ching-Hua Hsieh (198 patents)
• Hao-Jan Pei (34 patents)

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