Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semi-passive cooling using hierarchical vasculature

Semi-passive cooling using hierarchical vasculature

US Patent 12085333 · Granted Sep 10, 2024

Estimated economic value: $60,671,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Additive manufacture of hierarchically porous materials with high resolution2025
Additive manufacture of hierarchically porous materials with high resolution2025
Bio-ink structures and methods of producing the same2025
Inertially enhanced mass transport using porous flow-through electrodes with per2025
Inertially enhanced mass transport using porous flow-through electrodes with per2025
Shape-stable structures with ablative cooling2025
Engineered feedstocks for additive manufacture of glass2025
Engineered feedstocks for additive manufacture of glass2025
Microphone vibrational noise suppression2025
Additive manufacturing of microanalytical reference materials2025
Tailoring of pores in aerogels using 3D printed structures2025
Tailoring of pores in aerogels using 3D printed structures2025