Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for preparing semiconductor device structure with silicide portion between conductive plugs

Method for preparing semiconductor device structure with silicide portion between conductive plugs

US Patent 12080598 · Granted Sep 3, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device with redistribution plugs2025
Semiconductor device structure with silicide portion between conductive plugs2025
Method for fabricating semiconductor device with redistribution plugs2024
Method for preparing semiconductor device with composite landing pad2023
Method for preparing semiconductor memory device with air gaps between conductiv2023
Semiconductor device with composite landing pad for metal plug2022
Semiconductor memory device with air gaps between conductive features and method2022
Semiconductor device with air gaps and method for fabricating the same2021
Method for preparing a semiconductor device structure with an annular semiconduc2020
Photolithography method for reducing effects of lens aberration2006