Method of manufacturing housing for electronic communication device

Assignee

• Samsung

Inventors

• Seong Hyeon KIM (16 patents)
• Hyo-Sung Kang (6 patents)
• Min-Yong Kim (5 patents)
• Hyun-Young Roh (3 patents)
• Jung Bae PARK (24 patents)
• Tae-Young Bae (4 patents)
• Hyo-Won Seo (5 patents)
• Hae-Won Sung (4 patents)
• Gyung-Hoon Lee (3 patents)
• Bit Na KIM (8 patents)
• Byung Joon LEE (16 patents)

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