Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid metallic structures in stacked semiconductor devices and associated systems and methods

Hybrid metallic structures in stacked semiconductor devices and associated systems and methods

US Patent 12068282 · Granted Aug 20, 2024

Estimated economic value: $25,472,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reflector and illumination device a reflective layer and homogenization layer wi2025
Temperature calibration method of infrared thermal image camera and calibration 2024
Apparatus including integrated segments and methods of manufacturing the same2024
Temperature calibration method for a temperature measuring device2023
Stacked chip package structure and manufacturing method thereof2021
Semiconductor defects inspection apparatus2020
Semiconductor package and manufacturing method thereof2019
Stacked chip package structure and manufacturing method thereof2017
Polyimide metal laminated plate and method of making the same2017
Chip package structure having a shielded molding compound2016
Infrared absorption film, infrared absorption film manufacturing method and came2016
Photosensitive polyimide composition, base agent thereof, method of making the b2016