Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board

Assignee

• Atotech Deutschland

Inventors

• Akif Özkök (4 patents)
• Bert Reents (7 patents)
• Mustafa Özkök (2 patents)
• Marko Mirkovic (3 patents)
• Markus Youkhanis (4 patents)
• Horst Brüggmann (5 patents)
• Sven Lamprecht (9 patents)
• Kai-Jens Matejat (7 patents)

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