Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › RF device without silicon handle substrate for enhanced thermal and electrical performance and methods of forming the same

RF device without silicon handle substrate for enhanced thermal and electrical performance and methods of forming the same

US Patent 12062623 · Granted Aug 13, 2024

Estimated economic value: $14,998,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Control method for switches based on dual phase materials2025
Multi-level 3D stacked package and methods of forming the same2025
RF devices with enhanced performance and methods of forming the same2025
RF devices with enhanced performance and methods of forming the same2025
RF devices with enhanced performance and methods of forming the same2024
RF devices with enhanced performance and methods of forming the same2024
Microelectronics package with vertically stacked MEMS device and controller devi2024
RF devices with enhanced performance and methods of forming the same utilizing l2024
RF devices with enhanced performance and methods of forming the same utilizing l2024
RF devices with enhanced performance and methods of forming the same2024
RF devices with enhanced performance and methods of forming the same2024
RF devices with enhanced performance and methods of forming the same2024