Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bi-continuos epoxy microstructure for fabrication of degradable thermoset composite used in HTHP downhole conditions

Bi-continuos epoxy microstructure for fabrication of degradable thermoset composite used in HTHP downhole conditions

US Patent 12049557 · Granted Jul 30, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device control methods and systems2025
Phase retrieval detection device and method based on diffraction information of 2025
Information searching method and device, computer equipment and storage medium2025
Sofa2025
HTHP corrosion resistant composite seal via recrystallization of reactive compos2025
HTHP corrosion resistant composite seal via recrystallization of reactive compos2025
HTHP corrosion resistant composite seal via recrystallization of reactive compos2025
Channel attention-based swin-transformer image denoising method and system2025
Environmental control system for computing hardware in an autonomous driving veh2025
Preparation method of display panel, display panel and displaying device2025
Neural network model processing method and apparatus2025
Method for quantitatively characterizing dendrite segregation and dendrite spaci2025