Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor wafer having an auxiliary structure positioned in a scribe line region, semiconductor chip and method of fabricating a semiconductor wafer

Semiconductor wafer having an auxiliary structure positioned in a scribe line region, semiconductor chip and method of fabricating a semiconductor wafer

US Patent 12046563 · Granted Jul 23, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power semiconductor device having an electrode with an embedded material2025
Electronic circuit with a transistor device and a clamp circuit and method2025
Semiconductor die including an edge termination structure laterally between an a2025
Edge termination structure for power transistor devices2025
Semiconductor die having a sodium stopper in an insulation layer groove and meth2025
Semiconductor transistor device having a titled body contact area and method of 2024
Semiconductor die and method of manufacturing the same2024
Semiconductor device2024
Semiconductor device having a metallization structure2024
Contact structure for transistor devices2024
Power semiconductor device having a strain-inducing material embedded in an elec2023
Optically detectable reference feature for processing a semiconductor wafer2023