Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer-level optoelectronic packaging

Wafer-level optoelectronic packaging

US Patent 12038610 · Granted Jul 16, 2024

Estimated economic value: $6,274,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Photonic integrated circuit for amplifying optical signals2025
Loopback waveguide2024
Loopback waveguide2024
Flip-chip optoelectronic device2024
Optical dielectric waveguide subassembly structures2024
Method of forming an hermetic seal on electronic and optoelectronic packages2024
Photonic integrated chip2023
Loopback waveguide2023
Loopback waveguide2023
Methods for optical dielectric waveguide structure2022
Wafer-level optoelectronic packaging2022
Optical dielectric waveguide subassembly structures2022