Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Resin-sealed electronic component and method for manufacturing the same

Resin-sealed electronic component and method for manufacturing the same

US Patent 12030230 · Granted Jul 9, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Harness member2023
Harness member2023
Magnetostrictive torque sensor and design method of thickness of magnetic ring f2023