Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of for bonding noble metal structure with a dielectric layer using an adhesive layer

Method of for bonding noble metal structure with a dielectric layer using an adhesive layer

US Patent 12027190 · Granted Jul 2, 2024

Estimated economic value: $143,211,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Heat-assisted magnetic recording head with a bilayer adhesion structure2024
Adhesive layer for bonding noble metal structure with a dielectric layer2021
High refractive index hydrogenated silicon carbide and process2021
Devices including at least one adhesion layer and methods of forming adhesion la2021
Devices including a near field transducer (NFT) with nanoparticles2019
Devices including an overcoat layer2019
Waveguides including novel core materials2018
Devices including a near field transducer (NFT), at least one cladding layer and2018
Devices including a NFT having at least one amorphous alloy layer2018
Magnetic devices with overcoats2018
Devices including an amorphous gas barrier layer2018
Corrosion resistance cap located on end of waveguide core2018