Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for transferring missing semiconductor chips using an adhesive stamp

Method for transferring missing semiconductor chips using an adhesive stamp

US Patent 12014941 · Granted Jun 18, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for manufacturing an optoelectronic light emitting device2024
Method for producing a connection between component parts, and component made of2024
Method for producing an electronic component, wherein a semiconductor chip is po2023
Method for producing a connection between component parts2023
Method of manufacturing a semiconductor device and semiconductor device2023
Method of fastening a semiconductor chip on a lead frame, and electronic compone2023
Component having semiconductor bodies electrically conductively connected via a 2022
Optoelectronic semiconductor component, and method for producing an optoelectron2022
Method of fastening a semiconductor chip on a lead frame, and electronic compone2021
Method for producing a plurality of components2021
Method for structuring a nitride layer, structured dielectric layer, optoelectro2020
Optoelectronic component and method for producing an optoelectronic component2020