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Home › Multi-layer ceramic electronic component, multi-layer ceramic electronic component mounting substrate, multi-layer ceramic electronic component package, and method of producing a multi-layer ceramic electronic component

Multi-layer ceramic electronic component, multi-layer ceramic electronic component mounting substrate, multi-layer ceramic electronic component package, and method of producing a multi-layer ceramic electronic component

US Patent 12002626 · Granted Jun 4, 2024

Estimated economic value: $741,000 ⓘ

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