Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package comprising optically coupled IC chips

Semiconductor package comprising optically coupled IC chips

US Patent 11977256 · Granted May 7, 2024

Estimated economic value: $17,992,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for forming optical waveguide structure2025
Quantum dot film, quantum dot light-emitting diode and preparation method thereo2025
Semiconductor devices, systems, and methods for forming the same2025
Two-dimensional grating coupler and method of forming the same2025
Two-dimensional grating coupler and method of forming the same2025
Two-dimensional grating coupler and method of forming the same2025
Optical modulator and method of forming the same2025
Optical modulator and method of forming the same2025
Optical modulator and method of forming the same2025
Memory device2025
Methods for forming three-dimensional memory devices2025
Memory devices having vertical transistors and methods for forming the same2025