Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package and method for manufacturing the same

Semiconductor package and method for manufacturing the same

US Patent 11973048 · Granted Apr 30, 2024

Estimated economic value: $2,363,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic package structure2024
Semiconductor device package and a method of manufacturing the same2024
Semiconductor package structure and method of manufacturing the same2023
Semiconductor package structures and methods of manufacturing the same2023
Optical package structure and method of manufacturing the same2022
Semiconductor package structure2022
Semiconductor package and method for manufacturing the same2021
Semiconductor package and method for manufacturing the same2021
Semiconductor package and method for manufacturing the same2021
Semiconductor package including cap layer and dam structure and method of manufa2021
Semiconductor package including cap layer and dam structure and method of manufa2021
Semiconductor device package and method of manufacturing the same2021