Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ablation layer, photosensitive resin structure, method for producing relief printing plate using said photosensitive resin structure

Ablation layer, photosensitive resin structure, method for producing relief printing plate using said photosensitive resin structure

US Patent 11971658 · Granted Apr 30, 2024

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ablation layer, photosensitive resin structure, method for producing relief prin2022
Heat-reactive resist material, layered product for thermal lithography using the2016
Copper oxide etchant and etching method using the same2015
Etchant and etching method using the same2015