Sensor package structure having solder mask frame

Assignee

• Tong Hsing Electronic Industries

Inventors

• Fu-Chou Liu (15 patents)
• Jui-Hung Hsu (18 patents)
• Yu-Chiang Peng (3 patents)
• CHIEN-CHEN LEE (48 patents)
• Ya-Han Chang (19 patents)
• LI-CHUN HUNG (26 patents)

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