Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for forming hermetically-sealed packages including feedthrough assemblies

Methods for forming hermetically-sealed packages including feedthrough assemblies

US Patent 11950387 · Granted Apr 2, 2024

Estimated economic value: $36,357,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Syringe barrel2025
Kinetically limited nano-scale diffusion bond structures and methods2025
Hermetic assembly and device including same2025
Electronic package and device including same2024
System and method for valve control2024
Laser cutting system2024
Surface texturing using energy pulses2024
Nuclear radiation particle power converter2024
Hermetic assembly and device including same2024
Sealed package and method of forming same2023
Pressure sensor assembly for use in implantable medical device including a subst2023
System and method for valve control2023