Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of manufacturing circuits using thick metals and machined bulk dielectrics

Method of manufacturing circuits using thick metals and machined bulk dielectrics

US Patent 11950373 · Granted Apr 2, 2024

Estimated economic value: $266,413,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated convertible quadcopter with full field of regard2025
Integrated convertible quadcopter with full field of regard2023
Blind mate connector block and systems and methods thereof2022
Ruggedized antennas and systems and methods thereof2022
Mounting system with coolant connection having a self-sealing in-line valve and 2022
Stacked-disk antenna element with shaped wings2019
Method of manufacturing circuits using thick metals and machined bulk dielectric2019
Method of manufacturing circuits using thick metals and machined bulk dielectric2019
Insertion-extraction device for circuit card assemblies resident to the circuit 2017
Integrated electronic structure2015
Retaining and cooling system for line replaceable units2014
Method of internal mechanical connection for joined phased array sections2014