Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of forming conductive pipes between neighboring features, and integrated assemblies having conductive pipes between neighboring features

Methods of forming conductive pipes between neighboring features, and integrated assemblies having conductive pipes between neighboring features

US Patent 11948984 · Granted Apr 2, 2024

Estimated economic value: $29,188,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods of forming conductive pipes between neighboring features, and integrated2025
Methods of forming conductive pipes between neighboring features, and integrated2025
Methods of forming conductive pipes between neighboring features, and integrated2025
System for predicting properties of structures, imager system, and related metho2025
Reactor to form films on sidewalls of memory cells2025
Memory cell formation in three dimensional memory arrays using atomic layer depo2025
Memory array decoding and interconnects2025
Method of designing and fabricating patient-specific restorations from intra-ora2025
Word line structures for three-dimensional memory arrays2025
Integrated assemblies having graphene-containing-structures2025
Sparse piers for three-dimensional memory arrays2025
Dense piers for three-dimensional memory arrays2025